مؤلف: James D. Meindl

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Wa …

Make way for solutions to the challenges in chip reliability, power delivery, I/O signaling, and heat removal now blocking the way to ultimate performance 3D gigascale So C. This cutting-edge book on …