ERROR

نأسف - رغم أننا بذلنا قصارى جهدنا: حدث خطأ
Typedatabase
MessageYou have an error in your SQL syntax; check the manual that corresponds to your MariaDB server version for the right syntax to use near "AND SUBSTRING(categories_id,4,1) != "0") AS cat4, (SELECT categorie..." at line 5
QuerySELECT (SELECT categories_id FROM categories_description WHERE language_id = 11 AND categories_id = 000) AS cat1, (SELECT categories_id FROM categories_description WHERE language_id = 11 AND categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2, (SELECT categories_id FROM categories_description WHERE language_id = 11 AND categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3, (SELECT categories_id FROM categories_description WHERE language_id = 11 AND categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4, (SELECT categories_name FROM categories_description WHERE language_id = 11 AND categories_id = 000) AS cat1name, (SELECT categories_name FROM categories_description WHERE language_id = 11 AND categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2name, (SELECT categories_name FROM categories_description WHERE language_id = 11 AND categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3name, (SELECT categories_name FROM categories_description WHERE language_id = 11 AND categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4name, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = 000) AS cat1url, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2url, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3url, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4url, (SELECT wod_count_products FROM categories WHERE categories_id = 000) AS cat1cnt, (SELECT wod_count_products FROM categories WHERE categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2cnt, (SELECT wod_count_products FROM categories WHERE categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3cnt, (SELECT wod_count_products FROM categories WHERE categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4cnt

James E. Morris 
Nanopackaging [PDF ebook] 
Nanotechnologies and Electronics Packaging

الدعم

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks, ” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

€213.99
طرق الدفع

قائمة المحتويات

Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Application of Molecular Dynamics Simulation in Electronic Packaging.- Advances in Delamination Modeling.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges.- Nanostructured Resistor Materials.- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging.- Nanoconductive Adhesives.- Nanoparticles in Microvias.- Materials and Technology for Conductive Microstructures.- A Study of Nanoparticles in Sn Ag-Based Lead-Free Solders.- Nano-Underfills for Fine-Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- Carbon Nanotubes for Thermal Management of Microsystems.- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes.- Nanowires in Electronics Packaging.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanoelectronics Landscape: Application, Technology, and Economy.- Errata.

قم بشراء هذا الكتاب الإلكتروني واحصل على كتاب آخر مجانًا!
لغة الإنجليزية ● شكل PDF ● صفحات 543 ● ISBN 9780387473260 ● حجم الملف 14.4 MB ● عمر 02-99 سنوات ● محرر James E. Morris ● الناشر Springer US ● مدينة NY ● بلد US ● نشرت 2008 ● للتحميل 24 الشهور ● دقة EUR ● هوية شخصية 2145200 ● حماية النسخ DRM الاجتماعية

المزيد من الكتب الإلكترونية من نفس المؤلف (المؤلفين) / محرر

16٬630 كتب إلكترونية في هذه الفئة