Autor: Fred D. (University of Idaho, Moscow, USA) Barlow III

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2 Ebooks de Fred D. (University of Idaho, Moscow, USA) Barlow III

Portada de III, Fred D. (University of Idaho, Moscow, USA) Barlow & Aicha (University of Arkansas, Fayetteville, USA) Elshabini: Ceramic Interconnect Technology Handbook
III, Fred D. (University of Idaho, Moscow, USA) Barlow & Aicha (University of Arkansas, Fayetteville, USA) Elshabini: Ceramic Interconnect Technology Handbook
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information a …
EPUB
DRM
€224.98
Portada de III, Fred D. (University of Idaho, Moscow, USA) Barlow & Aicha (University of Arkansas, Fayetteville, USA) Elshabini: Ceramic Interconnect Technology Handbook
III, Fred D. (University of Idaho, Moscow, USA) Barlow & Aicha (University of Arkansas, Fayetteville, USA) Elshabini: Ceramic Interconnect Technology Handbook
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information a …
PDF
DRM
€132.83