Lead-free Electronics provides guidance on the design and use of
lead-free electronics as well as technical and legislative
perspectives. All the complex challenges confronting the
elec-tronics industry are skillfully addressed:
* Complying with state legislation
* Implementing the transition to lead-free electronics, including
anticipating associated costs and potential supply chain
issues
* Understanding intellectual property issues in lead-free alloys
and their applications, including licensing and infringement
* Implementing cost effective manufacturing and testing
* Reducing risks due to tin whiskers
* Finding lead-free solutions in harsh environments such as in the
automotive and telecommunications industries
* Understanding the capabilities and limitations of conductive
adhesives in lead-free interconnects
* Devising solutions for lead-free, flip-chip interconnects in
high-performance integrated circuit products
Each chapter is written by leading experts in the field and
carefully edited to ensure a consistent approach. Readers will find
all the latest information, including the most recent data on
cyclic thermomechanical deformation properties of lead-free Sn Ag Cu
alloys and a comparison of the properties of standard Sn-Pb versus
lead-free alloys, using the energy partitioning approach.
With legislative and market pressure to eliminate the use of lead
in electronics manufacturing, this timely publication is essential
reading for all engineers and professionals in the electronics
industry.
Tabla de materias
Preface.
Editors.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions &
Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of Selected
Lead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-Free
Solder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese Electronics
Industry.
Chapter 15. Guidelines for Implementing Lead-Free
Electronics.
Index.
Sobre el autor
SANKA GANESAN, PHD, is Associate Research Scientist at the
CALCE Electronic Products System Center, University of
Maryland. His research interests include advanced materials
and interfaces in electronics packages, sensors and MEMS, lead-free
electronics, low temperature electronics, and intermittent failures
in electronics systems. He has co-authored numerous
publications in leading journals and conference proceedings.
MICHAEL PECHT, Ph D, is Chair Professor, Director, and the
founder of the CALCE Electronic Products and Systems Center,
University of Maryland. Dr. Pecht is currently Chief Editor of
Microelectronics Reliability and has written sixteen books on
electronic products development. He has consulted for over fifty
major international electronics companies, providing expertise in
strategic planning, design, test, IP, and risk assessment of
electronic products and systems.
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