Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries – whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:
* Phase diagrams and alloy development
* Effect of minor alloying additions
* Composite approaches including nanoscale reinforcements
* Mechanical issues affecting reliability
* Reliability under impact loading
* Thermomechanical fatigue
* Chemical issues affecting reliability
* Whisker growth
* Electromigration
* Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
A propos de l’auteur
K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders.
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