ERROR

Нам шкода - хоча ми зробили все можливе: сталася помилка
Typedatabase
MessageYou have an error in your SQL syntax; check the manual that corresponds to your MariaDB server version for the right syntax to use near "AND SUBSTRING(categories_id,4,1) != "0") AS cat4, (SELECT categorie..." at line 5
QuerySELECT (SELECT categories_id FROM categories_description WHERE language_id = 10 AND categories_id = 000) AS cat1, (SELECT categories_id FROM categories_description WHERE language_id = 10 AND categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2, (SELECT categories_id FROM categories_description WHERE language_id = 10 AND categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3, (SELECT categories_id FROM categories_description WHERE language_id = 10 AND categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4, (SELECT categories_name FROM categories_description WHERE language_id = 10 AND categories_id = 000) AS cat1name, (SELECT categories_name FROM categories_description WHERE language_id = 10 AND categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2name, (SELECT categories_name FROM categories_description WHERE language_id = 10 AND categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3name, (SELECT categories_name FROM categories_description WHERE language_id = 10 AND categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4name, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = 000) AS cat1url, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2url, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3url, (SELECT url_text FROM commerce_seo_url_without_language WHERE categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4url, (SELECT wod_count_products FROM categories WHERE categories_id = 000) AS cat1cnt, (SELECT wod_count_products FROM categories WHERE categories_id = 00 AND SUBSTRING(categories_id,2,1) != "0") AS cat2cnt, (SELECT wod_count_products FROM categories WHERE categories_id = 0 AND SUBSTRING(categories_id,3,1) != "0") AS cat3cnt, (SELECT wod_count_products FROM categories WHERE categories_id = AND SUBSTRING(categories_id,4,1) != "0") AS cat4cnt

Penulis: Morihiro Kada

Dukung
Kazuo Kondo is Professor at Department of Chemical engineering, Osaka Prefecture University. He took his Ph D in Chemical Engineering at the University of Illinois in 1981. He has worked for Sumitomo Metal Industries, Hokkaido University and Okayama University. He has 200 research publications and 100 patents. His major research is Copper Electrodeposition for TSV. His research extends in various fields not only in electrodeposition, but also in battery and CVD. He is member of Electrochemical Society, IEEE, Society of Chemical engineering Japan, Japanese Institute of Electronics Packaging, Surface Finishing Society of Japan, Materia Japan, Electrochemistry Japan and Japanese Society of Applied Physics.  Morihiro Kada is the invited researcher of The National Institute of Advanced Industrial Science and Technology (AIST) and the part-time researcher of Osaka Prefecture University. Prior to joining to AIST and the university he was the consultant of Association of Super-Advanced Electronics Technologies (ASET). Since April 2007 he has been heading the Japanese national R&D project on 3D-Integration technology as the Project in ASET. Before joining to ASET, he had been the General Manager of the Advanced Packaging Development Department in Sharp Corporation. He has more than forty years experience in semiconductor packaging engineering, with major emphasis on developing chip scale, chip stack package and Three Dimensional-System in Package (3D-Si P) as the pioneer of 3D-Integration technology in the world. Kenji Takahashi is a Chief Specialist at Memory Packaging Development Department, Memory Division, Semiconductor & Strage Company, Toshiba Corporation. He received a M.E. Degree of from Chemical Engineering at the University of Tokyo in 1984 and Ph.D. from Information Science and Electrical Engineering at Kyushu University in 2010. His major research and development is focused on semiconductor packaging and chip packageinteraction, especially through-silicon via technology. He was the Research Manager of Electronic System Integration Technology Research Department, Association of Super-Advanced Electronics Technologies (ASET). He is a Senior Member of IEEE, a member of Society for Chemical Engineers, Japan, Institute of Electronics, Information and Communication Engineers and Japanese Institute of Electronics Packaging.




1 Ebooks oleh Morihiro Kada

Kazuo Kondo & Morihiro Kada: Three-Dimensional Integration of Semiconductors
This book starts with background concerning three-dimensional integration – including their low energy consumption and high speed image processing – and then proceeds to how to construct them and whi …
PDF
Inggris
€96.29