2 Ebook di Aicha Elshabini
III, Fred D. (University of Idaho, Moscow, USA) Barlow & Aicha (University of Arkansas, Fayetteville, USA) Elshabini: Ceramic Interconnect Technology Handbook
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information a …
EPUB
DRM
€224.73
III, Fred D. (University of Idaho, Moscow, USA) Barlow & Aicha (University of Arkansas, Fayetteville, USA) Elshabini: Ceramic Interconnect Technology Handbook
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information a …
PDF
DRM
€131.91
