This book explains one of the hottest topics in wireless and
electronic devices community, namely the wireless communication at
mm Wave frequencies, especially at the 60 GHz ISM band. It
provides the reader with knowledge and techniques for mm Wave
antenna design, evaluation, antenna and chip packaging.
* Addresses practical engineering issues such as RF material
evaluation and selection, antenna and packaging requirements,
manufacturing tolerances, antenna and system interconnections, and
antenna
* One of the first books to discuss the emerging research and
application areas, particularly chip packages with integrated
antennas, wafer scale mm Wave phased arrays and imaging
* Contains a good number of case studies to aid
understanding
* Provides the antenna and packaging technologies for the latest
and emerging applications with the emphases on antenna integrations
for practical applications such as wireless USB, wireless video,
phase array, automobile collision avoidance radar, and
imaging
Tabella dei contenuti
Chapter 1: Intruduction (Gaucher).
Chapter 2: mm Wave Packaging (Pfeiffer).
Chapter 3: Dielectric Properties at mm Wave and THz Bands
(Dougherty, Lanagan, Rajab).
Chapter 4: mm Wave Interconnects (Grzyb).
Chapter 5: Printed millimeter antennas – Multilayer
technologies (Mohamed, Lafond).
Chapter 6: Planar Waveguide-Type Slot Arrays (Ando,
Hirokawa).
Chapter 7: Antenna Design for 60 GHz Packaging Applications
(Liu).
Chapter 8: Monolithic Integrated Antennas (Öjefors,
Rydberg).
Chapter 9: Metamaterial for Antenna Applications (Itoh, Lai,
Lee).
Chapter 10: EBG Materials and Antennas (Weily, Esselle,
Bird).
Chapter 11: System to Circuit and Technology Implementation of
RF and mm Wave Switches (Plouchar).
Chapter 12: MEMS Switches (Hoivik).
Chapter 13: Phased Arrays (Pao, Aguirre).
Chapter 14: Integrated Phased Array (Hajimiri).
Chapter 15: mm Wave/THz Imaging (Luhmann, Yang, Shen).
Chapter 16: Millimeter-Wave System Overview (Reynolds).
Chapter 17: Special MMW Measurement Techniques (Zwick,
Pfeiffer).
Chapter 18: Micromachining and Silicon Processing (Tsang, Andry,
Steen)
Circa l’autore
Dr Duixian Liu, Yorktown Hights, US is a researcher at IBM at Thomas J. Watson Research Center since April 1996. His research interests are antenna design, electromagnetic modeling, digital signal processing, and communications technology. He received the IBM’s outstanding technical achievement awards in 2001 and 2002, and the IBM’s highest technical award, in 2003, for contributions to the integrated antenna subsystems for laptop computers.
Dr Ullrich Pfeiffer, Siegen, Germany is the head of the THz imaging group at the Institute of High-Frequency and Quantum Electronics at the University of Siegen, Germany. From 2001 to 2006 he was with the IBM T.J. Watson Research Center where his research involved RF circuit design, power amplifier design at 60 GHz and 77 GHz, high-frequency modeling and packaging for millimeter-wave communication systems. He is a member of the German Physical Society (DPG), and was the recipient of the 2004 and 2006 Lewis Winner Award for Outstanding Paper at the IEEE International Solid-State Circuit Conference. He received the European Young Investigator Award in 2006.
Dr Brian Gaucher, Yorktown Hights, US is a research staff member at the IBM T.J. Watson Research Center where he manages a communication system design and characterization group. His present research interests include 60 GHz Gbps wireless communication design and biomedical applications of wireless technology. His group has helped more than five products come to market. He is an IBM master inventor and holds two outstanding technical achievement awards and one corporate award.
Dr Janusz Grzyb, Pfaeffikon, Switzerland works at Huber + Suhner AG, Switzerland since 2006 as a senior R&D microwave engineer responsible for the development of a series of 60 GHz products. Before then, he worked at IBM T. J. Watson Research Center, NY. His primary responsibilities there were antenna and package design for 60-GHz wireless systems
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