Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
Tabella dei contenuti
Copper—Tin Reactions.- Copper–Tin Reactions in Bulk Samples.- Copper–Tin Reactions in Thin-Film Samples.- Copper–Tin Reactions in Flip Chip Solder Joints.- Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops.- Spontaneous Tin Whisker Growth: Mechanism and Prevention.- Solder Reactions on Nickel, Palladium, and Gold.- Electromigration and Thermomigration.- Fundamentals of Electromigration.- Electromigration in Flip Chip Solder Joints.- Polarity Effect of Electromigration on Solder Reactions.- Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration.- Thermomigration.
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