Pengarang: Shenglin Ma

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1 Ebooks by Shenglin Ma

Yufeng Jin & Shenglin Ma: TSV 3D RF Integration
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technolog …
EPUB
Inggeris
DRM
€250.99