This book constitutes the Proceedings of the International Conference on Internet of Everything and Quantum Information Processing (IEQIP-2023), held on 24–25 November 2023 in Andhra Pradesh, India. This edition was organized in hybrid mode by the Department of Computer Science and Engineering, Koneru Lakshmaiah Education Foundation, and sponsored by the Department of Science and Technology, India.

The Internet of Things (Io T) and Quantum Computing are technological phenomena that are shaping businesses and industries. Moreover, integrating Io T and Quantum Computing solutions evolves ecosystems to offer optimum commercial practices. The emergence of these two phenomena offers revolutionary advancements. Further, Quantum Computing introduces avant-garde encryption algorithms for resilient security solutions in Io T systems. Papers presented at this conference showed how the Internet of Everything (Io E) combines sensing, computation, information extraction, and communication functionalities together in a device. Io E allows different electronic devices with different capabilities to sense the environment and to communicate for data exchange. Further, the challenge now is to identify, monitor, and ensure quality in Io T security. Moreover, there is a significant rise in data and information transfer due to a rise in the number of devices. Hence, there is a requirement for responsive, scalable, analytical, and efficient solutions. 

            The conference papers included in this book contain topics in the following areas of research:

·         Artificial Intelligence

·         Quantum Computing

·         Internet of Things, Cloud Computing, and Data Science

·         Machine learning

·         Deep learning

·         Image, text, and signal processing

·         Disruptive technologies.

            This book provides helpful information to professors, researchers, and graduate students in the area of Quantum Computing and Io T, and all find this collection of papers inspiring, informative, and valuable.

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