This Second Edition focuses on emerging topics and advances in the
field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first
published, several major developments have taken place in the
field. Now, updated to reflect these advancements, this Second
Edition includes new information on copper interconnections,
nanotechnology circuit interconnects, electromigration in the
copper interconnections, parasitic inductances, and RLC models for
comprehensive analysis of interconnection delays and
crosstalk.
Each chapter is designed to exist independently or as a part of one
coherent unit, and several appropriate exercises are provided at
the end of each chapter, challenging the reader to gain further
insight into the contents being discussed. Chapter subjects
include:
* Preliminary Concepts
* Parasitic Resistances, Capacitances, and Inductances
* Interconnection Delays
* Crosstalk Analysis
* Electromigration-Induced Failure Analysis
* Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an
indispensable reference for high-speed VLSI designers, RF circuit
designers, and advanced students of electrical engineering.
O autorze
AShok k. Goel, Ph D, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit design, high-speed VLSI interconnections, device physics and modeling, and semiconductor TCAD.
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