Autor: Ronald J. Gutmann

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JOSEPH M. STEIGERWALD, Ph D, works for the Intel Corporation in Hillsboro, Oregon. Currently developing CMP processes for dielectric films, he has also worked for Intel in the areas of plasma and wet etching of thin films. Dr. Steigerwald earned his Ph D at Rensselaer Polytechnic Institute, where his thesis involved fundamental aspects of copper CMP. He holds a bachelor”s degree in electrical engineering from Clarkson University. SHYAM P. MURARKA, Ph D, is Director of the SRC Center for Advanced Interconnect Science and Technology at Rensselaer Polytechnic Institute, and a professor with the Center for Integrated Electronics and Electronics Manufacturing (CIEEM) and the Materials Science and Engineering Department at Rensselaer. He has also served as the Director of CIEEM (1994-1996) and Co-Director of New York”s SEMATECH Center of Excellence in Multilevel Interconnects (1990-1996). He is a Fellow of ASM International, IEEE, and AVS, and a member of the Electrochemical Society, TMS, and MRS. Dr. Murarka received a doctorate in chemistry from Agra University in India and one in metallurgy and materials science from the University of Minnesota. RONALD J. GUTMANN, Ph D, is Professor in Rensselaer Polytechnic Institute”s Department of Electrical, Computer and Systems Engineering, Coordinator of multifaculty programs in Low Dielectric Constant Interconnect Technology and Thermophotovoltaic Cell Technology, and a member of both the SEMATECH University Advisory Council and the Semiconductor Research Corporation University Advisory Committee. From 1989 to 1994 he served as Director of the Rensselaer Center for Integrated Electronics, an interdisciplinary research and education center involving 50 faculty with programs in electronic materials, processing techniques, semiconductor devices, characterization techniques, and VLSI design, and from 1990 to 1996 as Co-Director of New York”s Sematech Center of Excellence in Multilevel Interconnects. He is a Fellow of ieee. Dr. Gutmann received both his bachelor of electrical engineering degree and doctorate in electrophysics from Rensselaer Polytechnic Institute.




3 Ebooki wg Ronald J. Gutmann

Chuan Seng Tan & Ronald J. Gutmann: Wafer Level 3-D ICs Process Technology
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and e …
PDF
Angielski
€149.79
Joseph M. Steigerwald & Shyam P. Murarka: Chemical Mechanical Planarization of Microelectronic Materials
Chemical Mechanical Planarization (CMP) plays an important role in today’s microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its …
PDF
Angielski
DRM
€160.99
Christopher Lyle Borst & William N. Gill: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantag …
PDF
Angielski
DRM
€166.64