Autor: Toshiro Doi

Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the …

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of …

Handbook of Ceramics Grinding and Polishing meets the growing need in manufacturing industries for a clear understanding of the latest techniques in ceramics processing. The properties of ceramics …