Autor: Peter Sättler

wissenschaftliche Veröffentlichungen: Konferenzbeiträge: 2014 P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, “TSV-Annealing : A thermo-mechanical assessment, ” in Electronics System-Integration Technology Conference (ESTC), 2014, pp. 1–6. 2013 P. Saettler, M. Boettcher, C. Rudolph, and K. J. Wolter, “Bath chemistry and copper overburden as influencing factors of the TSV annealing, ” in Proceedings – Electronic Components and Technology Conference, 2013, pp. 1753–1758. P. Saettler, M. Boettcher, and K. J. Wolter, “µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery, ” in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Euro Sim E 2013, 2013, pp. 1–7. 2012 P. Saettler, M. Boettcher, and K. J. Wolter, “Characterization of the annealing behavior for copper-filled TSVs, ” in Proceedings – Electronic Components and Technology Conference, 2012, pp. 619–624. P. Saettler, D. Kovalenko, K. Meier, M. Roellig, M. Boettcher, and K. J. Wolter, “Thermo-mechanical characterization and modeling of TSV annealing behavior, ” in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Euro Sim E 2012, 2012, pp. 1/6–6/6. 2011 P. Saettler, K. Meier, and K. J. Wolter, “Considering copper anisotropy for advanced TSV-modeling, ” in Proceedings of the International Spring Seminar on Electronics Technology, 2011, pp. 419–423. Fachzeitschriften: 2015 P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, “µ-Raman Spectroscopy and FE-Modeling for TSV-Stress-Characterization, ” Microelectron. Eng., pp. 1–7, 2015. 2013 P. Saettler, M. Boettcher, C. Rudolph, and K.-J. Wolter, “Thermo-mechanische Charakterisierung des TSV-Annealing, ” Produktion von Leiterplatten und Syst., no. 7, pp. 1498–1507, 2013.