John H. Lau 
Through-Silicon Vias for 3D Integration [EPUB ebook] 

поддержка

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W2.5D IC integration with interposers3D IC integration with interposers Thermal management of 3D IC integration3D IC packaging

€187.83
Способы оплаты
Купите эту электронную книгу и получите еще одну БЕСПЛАТНО!
язык английский ● Формат EPUB ● страницы 512 ● ISBN 9780071785150 ● издатель McGraw-Hill Education ● опубликованный 2012 ● Загружаемые 6 раз ● валюта EUR ● Код товара 2503430 ● Защита от копирования Adobe DRM
Требуется устройство для чтения электронных книг с поддержкой DRM

Больше книг от того же автора (ов) / редактор

18 611 Электронные книги в этой категории