Електронна книга > Наука > Техника > Mitsuyoshi Akiyama & Dan Frangopol: Life-Cycle of Structural Systems (PDF)

Mitsuyoshi Akiyama & Dan Frangopol
Life-Cycle of Structural Systems [PDF ebook]
Design, Assessment, Maintenance and Management

поддержка

Обложка Mitsuyoshi Akiyama & Dan Frangopol: Life-Cycle of Structural Systems (PDF)

Collection of revised expert papers dealing with emerging concepts and innovative applications in life-cycle civil engineering. Topics covered include: life-cycle damage processes, life-cycle assessment and design, life-cycle maintenance and rehabilitation, life-cycle performance of special structures, life-cycle costs, and life cycle and integrated planning of buildings. Intended for researchers, engineers and advanced students working on life-cycle performance in civil engineering. Set comprises a book of extended abstracts (466 pp.) and a searchable DVD-ROM containing full papers (2332 pp.).

€308.10

Купите эту электронную книгу и получите еще одну БЕСПЛАТНО!

язык английский ● Формат PDF ● страницы 466 ● ISBN 9781315761800 ● редактор Mitsuyoshi Akiyama & Dan Frangopol ● издатель CRC Press ● опубликованный 2014 ● Загружаемые 3 раз ● валюта EUR ● Код товара 4112838 ● Защита от копирования Adobe DRM

Требуется устройство для чтения электронных книг с поддержкой DRM

Больше книг от того же автора (ов) / редактор

Mitsuyoshi Akiyama Dan Frangopol Hitoshi Furuta Dan M. Frangopol Osaka, Japan) Furuta Hitoshi (Kansai University IL, USA) Frangopol Dan M. (University of Illinois at Urbana-Champaign

96 355 Электронные книги в этой категории

Обложка A. sindhu devi: Cloud computing-an introduction

A. sindhu devi: Cloud computing-an introduction

This book " Cloud Computing — An Introduction " has been mainly written for Engineering and Computer science students This book gives you detailed description about cloud computing and help …

Обложка P.E., Ronald Hanifan: Reduce Your Engineering Drawing Errors

P.E., Ronald Hanifan: Reduce Your Engineering Drawing Errors

Обложка Jac Paauwe & Ian L. Spain: High Pressure Technology

Jac Paauwe & Ian L. Spain: High Pressure Technology

High pressure technology is used so extensively that it is almost impossible to catalogue the manyways in which our lives are enhanced by it. From pneumatic tires and household water supplies tomater …

Обложка Nicolae (University of Alaska Anchorage, USA) Lobontiu: Compliant Mechanisms

Nicolae (University of Alaska Anchorage, USA) Lobontiu: Compliant Mechanisms

With a rigorous and comprehensive coverage, the second edition of Compliant Mechanisms: Design of Flexure Hinges provides practical answers to the design and analysis of devices that incorporate flex …

Обложка Steven F. Blanding: Enterprise Operations Management Handbook, Second Edition

Steven F. Blanding: Enterprise Operations Management Handbook, Second Edition

The Enterprise Operations Management Handbook provides the expert advice and guidance of hundreds of leading computing practitioners and consultants. Covering all major areas of enterprise operations …

Обложка Arzhang (George Washington University, USA) Angoshtari & Ali Gerami (George Washington University, USA) Matin: Finite Element Methods in Civil and Mechanical Engineering

Arzhang (George Washington University, USA) Angoshtari & Ali Gerami (George Washington University, USA) Matin: Finite Element Methods in Civil and Mechanical Engineering

The finite element method is widely employed for numerical simulations in engineering and science due to its accuracy and efficiency. This concise introduction to the mathematical theory of the finit …

Обложка Lei Guo & Jin Jiang: Autonomous Safety Control of Flight Vehicles

Lei Guo & Jin Jiang: Autonomous Safety Control of Flight Vehicles

Aerospace vehicles are by their very nature a crucial environment for safety-critical systems. By virtue of an effective safety control system, the aerospace vehicle can maintain high performance des …

Обложка Chinmay K. (SOA University Bhubaneswar, Odisha, India) Maiti: Stress and Strain Engineering at Nanoscale in Semiconductor Devices

Chinmay K. (SOA University Bhubaneswar, Odisha, India) Maiti: Stress and Strain Engineering at Nanoscale in Semiconductor Devices

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, str …

Обложка Raul D. S. G. (Instituto Superior de Engenharia do Porto, Portugal) Campilho: Strength Prediction of Adhesively-Bonded Joints

Raul D. S. G. (Instituto Superior de Engenharia do Porto, Portugal) Campilho: Strength Prediction of Adhesively-Bonded Joints

Adhesively-bonded joints provide many advantages over conventional mechanical fasteners and are increasingly receiving attention as an alternative to mechanical joints in engineering applications. Th …

Обложка Yousef S. Kavian & Hamid Sharif: Technological Breakthroughs in Modern Wireless Sensor Applications

Yousef S. Kavian & Hamid Sharif: Technological Breakthroughs in Modern Wireless Sensor Applications

Следущая страница >>>