Since the first light-emitting diode (LED) was invented by Holonyak
and Bevacqua in 1962, LEDs have made remarkable progress in the
past few decades with the rapid development of epitaxy growth, chip
design and manufacture, packaging structure, processes, and
packaging materials. LEDs have superior characteristics such as
high efficiency, small size, long life, low power consumption, and
high reliability. The market for white LED is growing rapidly in
various applications. It has been widely accepted that white LEDs
will be the fourth illumination source to substitute the
incandescent, fluorescent, and high-pressure sodium lamps. With the
development of LED chip and packaging technologies, the efficiency
of high power white LED will broaden the application markets of
LEDs while changing the lighting concepts of our lives.
In LED Packaging for Lighting Applications, Professors
Liu and Luo cover the full spectrum of design, manufacturing, and
testing. Many concepts are proposed for the first time, and readers
will benefit from the concurrent engineering and co-design
approaches to advanced engineering design of LED products.
* One of the only books to cover LEDs from package design to
manufacturing to testing
* Focuses on the design of LED packaging and its applications
such as road lights
* Includes design methods and experiences necessary for LED
engineers, especially optical and thermal design
* Introduces novel LED packaging structures and manufacturing
processes, such as ASLP
* Covers reliability considerations, the most challenging problem
for the LED industry
* Provides measurement and testing standards, which are critical
for LED development, for both LED and LED fixtures
* Codes and demonstrations available from the book’s
Companion Website
This book is ideal for practicing engineers working in design or
packaging at LED companies and graduate students preparing for work
in industry. This book also provides a helpful introduction for
advanced undergraduates, graduates, researchers, lighting
designers, and product managers interested in the fundamentals of
LED design and production.
Color version of selected figures can be found at
www.wiley.com/go/liu/led
Об авторе
Sheng Liu is a Chang Jiang Professor of Mechanical
Engineering at Huazhong University of Science and Technology. He
holds a dual appointment at Wuhan National Laboratory for
Optoelectronics, and has served as tenured faculty at Wayne State
University. He has over 14 years experience in LED/MEMS/IC
packaging and extensive experience in consulting with many leading
multi-national and Chinese companies. Liu was awarded the White
House/NSF Presidential Faculty Fellowship in 1995, ASME Young
Engineer Award in 1996, and China NSFC Overseas Young Scientist in
1999. He has been an associate editor for IEEE Trans. On Electronic
Packaging Manufacturing since 1999 and an associate editor of
Journal of Frontiers of Optoelectronics in China since 2007. He is
currently one of the 11 National Committee Members in LED under
Ministry of Science and Technology. He obtained a Ph.D. from
Stanford in 1992, and got MS and BS in flight vehicle design,
Nanjing University of Aeronautics and Astronautics, and he had
three years industrial experience in China and USA. He has filed
more than 70 patents in China and the USA, and has published more
than 300 technical articles.
Xiaobing Luo is a professor at Huazhong University of
Science and Technology, Wuhan, China, with appointments at the
School of Energy and Power Engineering and Wuhan National Lab for
Optoelectronics. He received his Ph.D. in 2002 from Tsinghua
University, China. He has also worked in Samsung Electronics in
Korea as a Senior Engineer. His main research interests are LED,
heat and mass transfer, microfluidics, MEMS, and sensors and
actuators. He has published more than 60 papers and has applied for
40 patents in the USA, Korea, Japan, Europe and China.
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