автор: Yufeng Jin

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process-including design and manufact …

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process-including design and manufact …

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technolog …