Ibrahim (Abe) M. Elfadel has 15 years of industrial experience in the research, development and deployment of advanced computer-aided design (CAD) tools and methodologies for deep-submicron, high-performance digital designs. Most recently, he played a key role in the development and deployment of IBM’s next-generation layout verification tools for the ultra-deep submicron CMOS technology nodes. Dr. Elfadel is the recipient of six Invention Achievement Awards, an Outstanding Technical Achievement Award and a Research Division Award, all from IBM, for his contributions in the area of VLSI CAD. He is currently serving as an Associate Editor for the IEEE Transactions on Computer-Aided Design for Integrated Circuits and Systems.
Gerhard Fettweis earned his Ph.D. under H. Meyr”s supervision from RWTH Aachen in 1990. After one year at IBM Research in San Jose, CA he moved to TCSI Inc., Berkeley, CA. Since 1994 he is Vodafone Chair Professor at TU Dresden, Germany, with currently 20 companies from Asia/Europe/US sponsoring his research on wireless transmission and chip design. He coordinates 2 DFG centers at TU Dresden, cf AED and HAEC. Gerhard is IEEE Fellow, member of acatech, has an honorary doctorate from TU Tampere, and has received multiple awards. In Dresden he has spun-out ten start-ups, and setup funded projects of more than EUR 1/3 billion volume. He has helped organized IEEE conferences, most notably as TPC Chair of IEEE ICC 2009, IEEE TTM 2012, and Ge
neral Chair of VTC Spring 2013. He remains active within IEEE.
5 E-böcker av Ibrahim M. (Abe) Elfadel
Ibrahim M. (Abe) Elfadel & Michail Maniatakos: VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-So C 2017, held in Abu Dhabi …
EPUB
Engelska
DRM
€64.31
Ibrahim (Abe) M. Elfadel & Gerhard Fettweis: 3D Stacked Chips
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integrati …
PDF
Engelska
€53.49
Ibrahim (Abe) M. Elfadel & Duane S. Boning: Machine Learning in VLSI Computer-Aided Design
This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-large- …
PDF
Engelska
€181.89
Shahzad Muzaffar & Ibrahim (Abe) M. Elfadel: Secure, Low-Power IoT Communication Using Edge-Coded Signaling
This book discusses single-channel, device-to-device communication in the Internet of Things (Io T) at the signal encoding level and introduces a new family of encoding techniques that result in sign …
PDF
Engelska
€90.94
Ibrahim M. (Abe) Elfadel & Wajih U. Syed: Tapered Beams in MEMS
This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks. One such aspect is the ubiquitous use of tapere …
EPUB
Engelska
DRM
€95.78