Madhusudan Iyengar & Justin A Weibel 
EMBEDDED COOLING OF ELECTRONIC DEVICES [EPUB ebook] 
Conduction, Evaporation, and Single- and Two-Phase Convection

This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.

The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.

This book is a good starting point for the electrical and thermal engineers, as well as MS and Ph D students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Contents:

• Compact Thermal Modeling of Emerging Cooling Technologies for Processors (Zihao Yuan, Sherief Reda, and Ayse K Coskun)


• Microscale Evaporation for High Heat Flux Applications (Damena D Agonafer, Mun Mun Nahar, Binjian Ma, Zhikai Yang, Quan H Chau, Erdong Song, Jorge Padilla, and Madhusudan Iyengar)


• Numerical Modeling of Embedded Two-Phase Cooling in Silicon Microelectronics (Daniel Lorenzini and Yogendra Joshi)


• Chip-Embedded Two-Phase Cooling (Timothy Chainer, Pritish Parida, and Mark Schultz)


• Embedded Cooling of High-Power RF Amplifiers (John Ditri)


• Thermal Characteristics and Management Scheme of Self-Emissive and Liquid Crystal Displays (Sungki Kim)


• Advances in Materials Engineering for Conduction-limited Direct Contact Cooling (Arden L Moore)


• Monolithic Microfluidic Cooling Using Micropin-Fin Arrays for Local High Heat Flux Remediation: Design Considerations, Experimental Validation, and FPGA Integration (Thomas Sarvey, Ankit Kaul, and Muhannad S Bakir)


• Recent Experimental and Modeling Advances in Two-Phase Embedded Microfluidic Cooling (Todd A Kingston, Justin A Weibel, and Suresh V Garimella)


• Scaling Limits, Challenges, and Opportunities in Embedded Cooling (Srikanth Rangarajan, Scott N Schiffres, and Bahgat Sammakia)


• Co-Design of Thermal and Electromagnetics for Development of Light and Ultrahigh Efficiency Electric Motors (Ziaur Rahman, Michael Ohadi, and David Deisenroth)

Readership: Electrical, packaging and thermal engineers, as well as Mechanical Engineering and Electronic Engineering MS and Ph D students interested to understand and collaboratively tackle the complex and multidisciplinary field of microelectronics device (embedded) cooling.

Key Features:

• This book is a good starting point for electrical and thermal engineers and MS and Ph D students interested in microelectronics cooling


• It highlights the frontiers in the research and development of high-performance embedded cooling for 2D/3D heterogeneous integrated chips


• It also includes a deep dive into the fundamental physics of conduction and evaporation


• The book also covers the emerging and fast-growing field of thermal engineering