The idea for this book originated from a Special Session on Circuits and Systems for Future Generations of Wireless Communications that was presented at the 2005 International Symposiumon Circuits and Systems, which was then followed by two Special Issues bearing the same title that appeared in the March and April 2008 issues of the IEEE Transactions on Circuits and Systems – Part II: Express Briefs. Out of a large number of great contributions, we have selected those tting best the book format based on their quality. We would like to thank all the authors, the reviewers of the Transactions on Circuits and Systems – Part II, and the reviewers of the nal book material for their efforts in creating this manuscript. We also thank the Springer Editorial Staff for their support in putting together all the good work. We hope that this book will provide you, the reader, with new insights into Circuits and Systems for Future Generations of Wireless Communications.
Mục lục
A Multimode Radio Transceiver for Cellular Applications.- Reconfigurable Multi-Band OFDM UWB Receivers: Circuits and System Considerations.- Low Power UWB Circuits: Front-End Building Blocks.- CMOS IR-UWB Transceiver System Design for Contact-Less Chip Testing Applications.- Multi-mode Power Amplifiers for Wireless Handset Applications.- Polyphase Multipath Circuits for Cognitive Radio and Flexible Multi-phase Clock Generation.- IIP2 Improvement Techniques for Multi-standard Mobile Radio.- Multi-standard Continuous-Time Sigma–Delta Converters for 4G Radios.- Power Efficient Reconfigurable Baseband Filters for Multimode Radios.- An Adaptive Digital Front-End for Multi-mode Wireless Receivers.- FEC Decoders for Future Wireless Devices: Scalability Issues and Multi-standard Capabilities.
Giới thiệu về tác giả
Aleksandar Tasic: Qualcomm Incorporated, San Diego, California, USA, [email protected]
Wouter A. Serdijn: Department of Microelectronics, Electronics Research Laboratory, Delft University of Technology, Delft, the Netherlands, [email protected]
Lawrence E. Larson: Radio Frequency Integrated Circuits Group University of California San Diego, La Jolla, CA, USA, [email protected]
Gianluca Setti: Department of Engineering (ENDIF), University of Ferrara Advanced Research Center on Electronic Systems (ARCES), University of Bologna, [email protected]
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