Excellent teaching and resource material . . . it is concise,
coherently structured, and easy to read . . . highly recommended
for students, engineers, and researchers in all related
fields.’
-Corrosion on the First Edition of Fundamentals of Electrochemical
Deposition
From computer hardware to automobiles, medical diagnostics to
aerospace, electrochemical deposition plays a crucial role in an
array of key industries. Fundamentals of Electrochemical
Deposition, Second Edition is a comprehensive introduction to one
of today’s most exciting and rapidly evolving fields of practical
knowledge.
The most authoritative introduction to the field so far, the book
presents detailed coverage of the full range of electrochemical
deposition processes and technologies, including:
* Metal-solution interphase
* Charge transfer across an interphase
* Formation of an equilibrium electrode potential
* Nucleation and growth of thin films
* Kinetics and mechanisms of electrodeposition
* Electroless deposition
* In situ characterization of deposition processes
* Structure and properties of deposits
* Multilayered and composite thin films
* Interdiffusion in thin film
* Applications in the semiconductor industry and the field of
medicine
This new edition updates the prior edition to address the new
developments in the science and its applications, with new chapters
on innovative applications of electrochemical deposition in
semiconductor technology, magnetism and microelectronics, and
medical instrumentation. Added coverage includes such topics as
binding energy, nanoclusters, atomic force, and scanning tunneling
microscopy.Example problems at the end of chapters and other
features clarify and improve understanding of the material.
Written by an author team with extensive experience in both
industry and academe, this reference and text provides a
well-rounded introduction to the field for students, as well as a
means for professional chemists, engineers, and technicians to
expand and sharpen their skills in using the technology.
Mục lục
Preface to the Second Edition.
Preface to the First Edition.
1. Overview.
2. Water and Ionic Solutions.
3. Metals and Metal Sufaces.
4. Metal-Solution Interphase.
5. Equilibrium Electrode Potential.
6. Kinetics and Mechanism of Electrodeposition.
7. Nucleation and Growth Models.
8. Electroless Deposition.
9. Displacement Deposition.
10. Effect of Additives.
11. Electrodeposition of Alloys.
12. Metal Deposit and Current Distribution.
13. Characterization of metallic Surfaces and Thin Films.
14. In Situ Characterization of Deposition.
15. Mathematical Modeling in Electrochemistry.
16. Structure anad Properties of Deposits.
17. Electrodeposited Multilayers.
18. Interdiffusion in Thin Films.
19. Applications in Semiconductors Technology.
20. Applications in the Fields of Magnetism and
Microelectronics.
21. Frontiers in Applications: Applications in the Field of
Medicine.
Index.
Giới thiệu về tác giả
MILAN PAUNOVIC, Ph D, was, until recently, a research staff
member in the Electrodeposition Technology Department at the IBM T.
J. Watson Research Center. He began work on electrochemical metal
deposition in 1961 at the University of Pennsylvania, Philadelphia,
and subsequently worked on metal deposition at Reynolds Metals,
Kollmorgen, and Intel. He is a coauthor of the first edition of
Fundamentals of Electrochemical Deposition and Modern
Electroplating (both by Wiley), has edited four symposia
proceedings volumes of The Electrochemical Society, published
forty-one papers, and holds seven patents.
MORDECHAY SCHLESINGER, Ph D, is a professor in the
Department of Physics at the University of Windsor, Ontario,
Canada. He is a former associate editor of both the Journal of The
Electrochemical Society and Electrochemical and Solid State
Letters. He is a fellow of the American Physical Society and The
Electrochemical Society. He has also been named a General Motors
Academic Research Fellow. He is a coauthor of the first edition of
Fundamentals of Electrochemical Deposition and of Modern
Electroplating. He has published over 120 research papers and holds
four patents.
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