It has been widely recognized that embedded and ubiquitous computing will have tremendous impacts on many aspects of our daily life. Innovation and close collaboration between academia and industry are the keys to guaranteeing success in the development and deployment of the technology in embedded and ubiquitous computing. The IFIP International Conferenceon Embeddedand Ubiquitous Computing (EUC) provides a forum for engineers and scientists in academia, industry, and governmentto address challenges and to present and discuss their ideas, results, work in progress and experience. The Technical Program Committee (TPC) of EUC 2007 was lead by the TPC Chair, Tei-Wei Kuo, and TPC Vice Chairs. A strong international TPC was formed to review and evaluate the submissions. Each paper was reviewed carefully by at least three TPC members or external reviewers. It was extremely di?cult for the TPC to select the presentations because there were so many excellent and interesting submissions. There were 217 submissions from all over the world, and only 65 papers are published in this proceedings volume.
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