1 电子书 Alaa El-Rouby
Khaled Salah & Yehea Ismail: Arbitrary Modeling of TSVs for 3D Integrated Circuits
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, includin …
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€96.29
