Mikhail R. Baklanov
IMEC, Leuven, Belgium
Paul S. Ho
Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA
Ehrenfried Zschech
Fraunhofer Institute for Nondestructive Testing, Dresden, Germany
3 电子书 Ehrenfried Zschech
Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra …
PDF
英语
DRM
€159.99
Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra …
EPUB
英语
DRM
€159.99
