作者: Kaishun Wu

Zhidan Liu is currently Assistant Professor in the College of Computer Science and Software Engineering, Shenzhen University, China. He received a Ph.D. degree in Computer Science and Technology from Zhejiang University, China, in 2014. Before joining in Shenzhen University, he was Postdoctoral Research Fellow in the School of Computer Science and Engineering, Nanyang Technological University, Singapore. Dr. Liu’s research interests include Internet of Things, urban computing, crowdsourcing, and big data analytics. He has published more than 20 research papers in top-tier international journals and conferences, including IEEE/ACM To N, IEEE TMC, IEEE TITS, IEEE Network Magazine, IEEE IOTJ, ACM Mobi Sys, IEEE ICDE, ACM/IEEE IPSN, and ACM Mobi Hoc. He received the “Best Paper Award” of IEEE ICPADS 2020. Dr. Liu served as Technical Programme Committee Member of IEEE ICDCS, IEEE ICPADS, IEEE ICCCN, IEEE MSN, IEEE MASS, and IEEE Hi PC. He is  Member of IEEE, ACM, and CCF. Kaishun Wu is currently Distinguished Professor in the College of Computer Science and Software Engineering, Shenzhen University, China, where he leads the Research Centre of Internet of Things. Professor Wu’s research interests include wireless communications and mobile computing. He has co-authored 2 books and published over 100 refereed papers in international leading journals and primer conferences. He is Inventor of 8 US and 100 Chinese pending patents (63 are issued). Professor Wu serves as Associate Editor of IET COMMUNICATIONS, IEEE Access, and Guest Editor of IEEE Network. He is Technical Program Committee Member of IEEE INFOCOM, IEEE ICDCS, IEEE ICC, IEEE Globecom, and so on. He won the best paper awards in IEEE Globecom 2012, IEEE ICPADS 2012, IEEE MASS 2014, IEEE SECON 2018. Professor Wu was selected as Winner of 2012 Hong Kong Young Scientist Award. He was also one of the winners of 2014 Hong Kong ICT Awards: Best Innovation. He received 2014 IEEE Com Soc Asia-Pacific Outstanding Young Researcher Award. He is IET Fellow and IEEE Senior Member.