This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.
表中的内容
Section 1: I, Intern (& Setting up an Advanced Tech Integration Program).- The Interview.- The Start.- The Background (and Beer with Cz).- The Challenge (Why do Advanced Technology Development).- The Value (of an Advanced Technology Program).- The Knobs (for Setting Up an Advanced Technology Effort).- The Proposals.- The Good-Bye.- A Technologist: Cz’s Contemplations (circa year 0).- Section 2: I, Engineer (& Running Integration Tech Development).- I’m Back!.- Managing Learning (in a Matrix Organization).- Managing Compensation (in a Matrix Organization).- Reorganization (into Line Organization).- The Challenge (How To Do the Integration Technology Development).- Test Chip Engagement (& the Assignment I did not get).- Path Finding Engagement (and the Assignment that I did get).- A Manager: Steve’s Soliloquy (circa + 3 years).- Section 3: I, Leader (Product Intersection & Handing off the Learning).- I’m Back!.- Process Transfer Case Study (IPD).- Methodology Transfer Case Study (Multi-Physics Stress Modeling).- Concept Transfer Case Study (2.5D Integration Path Finding).- The Big Picture (Development of More-than-Moore Integration Technologies).- A Businessman: Mao’s Musings (Circa + 5 years).
关于作者
Riko Radojcic is an independent consultant specialized in 2.5D and 3D integration technologies, Df X process-design integration techniques, and advanced technology management.
Most recently, he was a Senior Director of Technology at Qualcomm Technologies Inc. where he led the 2.5D and 3D Technology Integration team, addressing all aspects of advanced integration options, ranging from architecture down to manufacturability. In the previous years with Qualcomm, Riko has led a number of Design-for-Technology initiatives, including Design-for-3D, Design-for-Thermal, Design-for-Stress, Design-for-Variability, Design-for-Manufacturability, etc.
Radojcic has more than thirty years’ experience in the semiconductor industry, and has specialized in integration of process technology and design considerations. Before joining Qualcomm, he was an independent consultant to semiconductor and EDA companies providing engineering and business development services. Beforethat, he focused on design technology, process characterization and modeling integration, with PDF Solutions (director of marketing), Tality Corporation (Business Manager) and Cadence (architect). Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.
Radojcic received his BSc and Ph D degrees from University of Salford (Manchester), UK.
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