Shichun Qu & Yong Liu 
Wafer-Level Chip-Scale Packaging [PDF ebook] 
Analog and Power Semiconductor Applications

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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-...

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€160.49
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表中的内容

Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging.- Chapter 2. Fan-In Analog Wafer Level Chip Scale Package.- Chapter 3. Fan-Out Analog Wafer ...

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语言 英语 ● 格式 PDF ● 网页 322 ● ISBN 9781493915569 ● 文件大小 20.3 MB ● 年龄 02-99 年份 ● 出版者 Springer New York ● 市 NY ● 国家 US ● 发布时间 2014 ● 下载 24 个月 ● 货币 EUR ● ID 4619400 ● 复制保护 社会DRM

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