Flexible electronics is an emerging field with the potential for huge industrial importance. Comprising of three volumes, this work offers a cohesive, coherent and comprehensive overview of the subject. Themes covered include mechanical theory, materials science aspects, fabrication technologies, devices and applications.
Khanna provides a systematic, step-by-step treatment of each topic and utilizes clear and attractive illustrations throughout. The latest research and developments in this discipline are included, providing an excellent resource for graduate students, researchers and industry scientists.
This volume covers the mechanical aspects of hard-film/soft-substrate structures and the impacts of stress and strain, including deformation and cycling of ductile films, and straining permeation barriers.
表中的内容
1.The Flexible Electronics Paradigm
2.Mechanical Bending of a Circuit
3.Stresses and Strains in the Hard-Film/Soft-Substrate Structure
4.Curvature and Overlay Alignment of the Hard-Film/Soft-Substrate Structure
5.Providing Stretchability by Controlled Buckling of Films
6.Bending Brittle Films
7.Deformation and Cycling of Ductile Films
8.Straining Permeation Barriers
Part 2: Materials
9.Inorganic Materials
10.Organic Materials
11.Nanomaterials: CNTs, Nanowires, Graphene and 2-D Materials
Part 3: Manufacturing Equipment and Machines
12.Printing Techniques
13.Vacuum Deposition
14.Silicon Microlectronics/MEMS Processes
15.Packaging
关于作者
Vinod Kumar Khanna is a former Emeritus Scientist at CSIR-Central Electronics Engineering Research Institute, Pilani, India, and Emeritus Professor at the Academy of Scientific & Innovative Research, India. He is a retired Chief Scientist and Head of the MEMS & Microsensors Group, CSIR-CEERI, Pilani.来自同一作者的更多电子书 / 编辑
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