Discover a comprehensive overview and advances in mechanics to design the cutting edge electronics
Soft electronics systems, which include flexible and stretchable electronics, are an area of technology with the potential to revolutionize fields from healthcare to defense. Engineering for flexibility and stretchability without compromising electronic functions poses serious challenges, and extensive mechanics and engineering knowledge is required to meet these challenges. Mechanics of Flexible and Stretchable Electronics introduces a range of soft functional materials and soft structures and their potential applications in the construction of soft electronics systems. Its detailed attention to the mechanics of these materials and structures makes it an indispensable tool for scientists and engineers at the cutting edge of electronics technology.
Mechanics of Flexible and Stretchable Electronics readers will also find:
- A detailed summary of recent advances in the field
- Detailed treatment of structures including kirigami, serpentine, wrinkles, and many more
- A multidisciplinary approach suited to a varied readership
Mechanics of Flexible and Stretchable Electronics is ideal for electronics and mechanical engineers, solid state physicists, and materials scientists, as well as the libraries that support them.
表中的内容
Part I Mechanics of materials
1. Mechanics of metal thin films
2. Mechanics of Ag nanowires
3. Mechanics of 2D materials in soft electronics
4. Mechanics of soft matter
5. Fracture mechanics of soft materials
6. Mechanics in materials characterization
7. Mechanics of organic electronics
8. Mechanics of composites
9. Mechanics of liquid metal
10. Mechanics of self-healable, recyclable materials
Part II Mechanics of structures
11. Mechanics of serpentine
12. Instabilities (wrinkling, buckling ?)
13. Mechanics of 3D assembly / soft network
14. Origami and kirigami
15. Mechanics of stretchable architected materials
Part III Mechanics in manufacture
16. Mechanics of transfer printing
17. Mechanics in 4D printing
18. Mechanics in electrospinning
Part IV Mechanics of bio-assembly
19. Mechanics of transient electronics
20. Bio-electronics interface – conformable
21. Bio-electronics interface – thermal
22. Wet adhesion
23. Mechanics of complex wearable systems
关于作者
Yong Zhu, Ph D, is the Andrew A. Adams Distinguished Professor in the Department of Mechanical and Aerospace Engineering at North Carolina State University (NCSU). He received his Ph.D. degrees from Northwestern University. His work has been recognized with a number of awards including James R. Rice Medal from the Society of Engineering Science, Bessel Research Award from the Alexander von Humboldt Foundation, Zdeněk P. Bažant Medal and Gustus L. Larson Memorial Award from ASME.
Nanshu Lu, Ph D, is Full Professor at the University of Texas at Austin. She received her B.Eng. from Tsinghua University, Beijing, Ph.D. from Harvard University, and then Beckman Postdoctoral Fellowship at UIUC. She has been named 35 innovators under 35 by MIT Technology Review (TR 35) and i CANX/ACS Nano Inaugural Rising Star. She has received US NSF CAREER Award, US ONR and AFOSR Young Investigator Awards, 3M non-tenured faculty award, and the ASME Applied Mechanics Division Thomas J.R. Hughes Young Investigator Award. She has been selected as one of the five great innovators on campus and five world-changing women of the University of Texas at Austin.
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