The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics. This book provides an overview of the methodologies and characterization techniques used for investigating low-k nanoporous interdielectrics.
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स्वरूप PDF ● पेज 75 ● ISBN 9781617283185 ● संपादक Kyuyoung Heo & Moonhor Ree ● प्रकाशक Nova Science Publishers ● प्रकाशित 2016 ● डाउनलोड करने योग्य 3 बार ● मुद्रा EUR ● आईडी 7228480 ● कॉपी सुरक्षा Adobe DRM
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