Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.
€145.77
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भाषा अंग्रेज़ी ● स्वरूप PDF ● पेज 280 ● ISBN 9781608076987 ● प्रकाशक Artech House ● प्रकाशित 2013 ● डाउनलोड करने योग्य 3 बार ● मुद्रा EUR ● आईडी 4414092 ● कॉपी सुरक्षा Adobe DRM
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