Jörg Franke 
Three-Dimensional Molded Interconnect Devices (3D-MID) [PDF ebook] 
Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

Dukung

Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible tha...

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Tentang Penulis

Prof. Dr.-Ing. Jörg Franke ist Leiter des Lehrstuhls für Fertigungsautomatisierung und Produktionssystematik (FAPS) an der Friedrich-Alexander-Universität Erlangen-N...

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Bahasa Inggris ● Format PDF ● Halaman 368 ● ISBN 9781569905524 ● Ukuran file 27.1 MB ● Editor Jörg Franke ● Penerbit Hanser Publications ● Kota München ● Negara DE ● Diterbitkan 2014 ● Edisi 1 ● Diunduh 24 bulan ● Mata uang EUR ● ID 3038898 ● Perlindungan salinan DRM sosial

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