Jörg Franke 
Three-Dimensional Molded Interconnect Devices (3D-MID) [PDF ebook] 
Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

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Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible tha...

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Sobre o autor

Prof. Dr.-Ing. Jörg Franke ist Leiter des Lehrstuhls für Fertigungsautomatisierung und Produktionssystematik (FAPS) an der Friedrich-Alexander-Universität Erlangen-Nür...

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Língua Inglês ● Formato PDF ● Páginas 368 ● ISBN 9781569905524 ● Tamanho do arquivo 27.1 MB ● Editor Jörg Franke ● Editora Hanser Publications ● Cidade München ● País DE ● Publicado 2014 ● Edição 1 ● Carregável 24 meses ● Moeda EUR ● ID 3038898 ● Proteção contra cópia DRM social

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