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Paul S. Ho & Wei William Lee
Low Dielectric Constant Materials for IC Applications [PDF ebook]

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Cover of Paul S. Ho & Wei William Lee: Low Dielectric Constant Materials for IC Applications (PDF)

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

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Language English ● Format PDF ● ISBN 9783642559082 ● Editor Paul S. Ho & Wei William Lee ● Publisher Springer Berlin Heidelberg ● Published 2012 ● Downloadable 3 times ● Currency EUR ● ID 6326766 ● Copy protection Adobe DRM

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