Lennart Bamberg & Jan Moritz Joseph 
3D Interconnect Architectures for Heterogeneous Technologies [PDF ebook] 
Modeling and Optimization

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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (So Cs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for So C integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical ...

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€117.69
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Tabela de Conteúdo

Part I Introduction.- 1 Introduction to 3D Technologies .- 1.1 Motivation for Heterogenous 3D ICs.- 1.2 3D Technologies.- 1.3 TSV Capacitances—A Problem Resista...

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Sobre o autor

Lennart Bamberg received the B.Sc., M.Sc., and Ph.D. (Dr.-Ing. ) degree with highest honours (“summa cum laude”) in electrical and computer engineering from the Univer...

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Língua Inglês ● Formato PDF ● Páginas 395 ● ISBN 9783030982294 ● Tamanho do arquivo 11.5 MB ● Editora Springer International Publishing ● Cidade Cham ● País CH ● Publicado 2022 ● Carregável 24 meses ● Moeda EUR ● ID 8440032 ● Proteção contra cópia DRM social

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