Lennart Bamberg & Jan Moritz Joseph 
3D Interconnect Architectures for Heterogeneous Technologies [PDF ebook] 
Modeling and Optimization

Destek

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (So Cs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for So C integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical ...

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€117.69
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İçerik tablosu

Part I Introduction.- 1 Introduction to 3D Technologies .- 1.1 Motivation for Heterogenous 3D ICs.- 1.2 3D Technologies.- 1.3 TSV Capacitances—A Problem Resistant t...

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Yazar hakkında

Lennart Bamberg received the B.Sc., M.Sc., and Ph.D. (Dr.-Ing. ) degree with highest honours (“summa cum laude”) in electrical and computer engineering from the Unive...

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Dil İngilizce ● Biçim PDF ● Sayfalar 395 ● ISBN 9783030982294 ● Dosya boyutu 11.5 MB ● Yayımcı Springer International Publishing ● Kent Cham ● Ülke CH ● Yayınlanan 2022 ● İndirilebilir 24 aylar ● Döviz EUR ● Kimlik 8440032 ● Kopya koruma Sosyal DRM

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