Brandon Noia & Krishnendu Chakrabarty 
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs [PDF ebook] 

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This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

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Содержание

Introduction.- Wafer Stacking and 3D Memory Test.- Built-in Self-Test for TSVs.- Pre-Bond TSV Test Through TSV Probing.- Pre-Bond TSV Test Through TSV Probing.- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths.- Post-Bond Test Wrappers and Emerging Test Standards.- Test-Architecture Optimization and Test Scheduling.- Conclusions.

Об авторе

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his Ph D from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.

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язык английский ● Формат PDF ● страницы 245 ● ISBN 9783319023786 ● Размер файла 7.0 MB ● издатель Springer International Publishing ● город Cham ● Страна CH ● опубликованный 2013 ● Загружаемые 24 месяцы ● валюта EUR ● Код товара 2854793 ● Защита от копирования Социальный DRM

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