ผู้เขียน: Paul S. Ho

สนับสนุน
Mikhail R. Baklanov IMEC, Leuven, Belgium Paul S. Ho Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA Ehrenfried Zschech Fraunhofer Institute for Nondestructive Testing, Dresden, Germany




4 หนังสืออิเล็กทรอนิกส์โดย Paul S. Ho

Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra …
PDF
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DRM
€159.99
Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra …
EPUB
อังกฤษ
DRM
€159.99
Paul S. Ho & Wei William Lee: Low Dielectric Constant Materials for IC Applications
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film mate …
PDF
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DRM
€166.66
Martin Gall & Paul S. Ho: Electromigration in Metals
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€96.09