Mikhail R. Baklanov
IMEC, Leuven, Belgium
Paul S. Ho
Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA
Ehrenfried Zschech
Fraunhofer Institute for Nondestructive Testing, Dresden, Germany
4 Ebooks por Paul S. Ho
Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra …
PDF
Inglês
DRM
€159.99
Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra …
EPUB
Inglês
DRM
€159.99
Paul S. Ho & Wei William Lee: Low Dielectric Constant Materials for IC Applications
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film mate …
PDF
Inglês
DRM
€166.66
