High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread – particularly packaging.This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (Si C) power MOSFETs.Coverage includes an introduction; multi-chip power modules; module design and transfer to Si C technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable Si C power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.
Alberto & Andrea
SiC Power Module Design [EPUB ebook]
Performance, robustness and reliability
SiC Power Module Design [EPUB ebook]
Performance, robustness and reliability
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语言 英语 ● 格式 EPUB ● ISBN 9781785619083 ● 编辑 Alberto & Andrea ● 出版者 The Institution of Engineering and Technology ● 下载 3 时 ● 货币 EUR ● ID 8233574 ● 复制保护 Adobe DRM
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