Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
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Język Angielski ● Format PDF ● ISBN 9781489918048 ● Wydawca Springer US ● Opublikowany 2013 ● Do pobrania 3 czasy ● Waluta EUR ● ID 4652091 ● Ochrona przed kopiowaniem Adobe DRM
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