Catalog > Ciencia > Técnica > Electrónica, Ingeniería eléctrica, Telecomunicaciones > Tzyy-Sheng Jason Horng & Lih-Tyng Hwang: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (PDF)

Tzyy-Sheng Jason Horng & Lih-Tyng Hwang
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility [PDF ebook]

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Portada de Tzyy-Sheng Jason Horng & Lih-Tyng Hwang: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (PDF)

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

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Idioma Inglés ● Formato PDF ● ISBN 9781119289678 ● Editorial Wiley ● Publicado 2018 ● Descargable 3 veces ● Divisa EUR ● ID 6273705 ● Protección de copia Adobe DRM

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