Електронна книга > Наука > Техніка > Електроніка, електротехніка, телекомунікації > Tzyy-Sheng Jason Horng & Lih-Tyng Hwang: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (PDF)

Tzyy-Sheng Jason Horng & Lih-Tyng Hwang
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility [PDF ebook]

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Обкладинка Tzyy-Sheng Jason Horng & Lih-Tyng Hwang: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (PDF)

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

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Мова Англійська ● Формат PDF ● ISBN 9781119289678 ● Видавець Wiley ● Опубліковано 2018 ● Завантажувані 3 разів ● Валюта EUR ● Посвідчення особи 6273705 ● Захист від копіювання Adobe DRM

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Hwang Lih-Tyng Hwang Horng Tzyy-Sheng Jason Horng Tzyy-Sheng Jason Horng Lih-Tyng Hwang

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