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Thomas Moore
Characterization of Integrated Circuit Packaging Materials [PDF ebook]

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Couverture du Thomas Moore: Characterization of Integrated Circuit Packaging Materials (PDF)

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

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Langue Anglais ● Format PDF ● ISBN 9781483292342 ● Éditeur Thomas Moore ● Maison d’édition Elsevier Science ● Publié 2013 ● Téléchargeable 3 fois ● Devise EUR ● ID 5737073 ● Protection contre la copie Adobe DRM

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