Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
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语言 英语 ● 格式 PDF ● ISBN 9781483292342 ● 编辑 Thomas Moore ● 出版者 Elsevier Science ● 发布时间 2013 ● 下载 3 时 ● 货币 EUR ● ID 5737073 ● 复制保护 Adobe DRM
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