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Thomas Moore
Characterization of Integrated Circuit Packaging Materials [PDF ebook]

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Sampul Thomas Moore: Characterization of Integrated Circuit Packaging Materials (PDF)

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

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Bahasa Inggris ● Format PDF ● ISBN 9781483292342 ● Editor Thomas Moore ● Penerbit Elsevier Science ● Diterbitkan 2013 ● Diunduh 3 kali ● Mata uang EUR ● ID 5737073 ● Perlindungan salinan Adobe DRM

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