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Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging
Materials for High-Density Electronic Packaging and Interconnection [PDF ebook]

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Cover of Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging: Materials for High-Density Electronic Packaging and Interconnection (PDF)

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Language English ● Format PDF ● Pages 156 ● ISBN 9780309536691 ● Publisher National Academies Press ● Published 1990 ● Downloadable 3 times ● Currency EUR ● ID 7146652 ● Copy protection Adobe DRM

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Commission on Engineering and Technical Systems Committee on Materials for High-Density Electronic Packaging Division on Engineering and Physical Sciences National Materials Advisory Board National Research Council

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