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Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging
Materials for High-Density Electronic Packaging and Interconnection [PDF ebook]

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Capa do Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging: Materials for High-Density Electronic Packaging and Interconnection (PDF)

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Língua Inglês ● Formato PDF ● Páginas 156 ● ISBN 9780309536691 ● Editora National Academies Press ● Publicado 1990 ● Carregável 3 vezes ● Moeda EUR ● ID 7146652 ● Proteção contra cópia Adobe DRM

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